In contrast to droplet epitaxy, droplet etching takes place at significantly higher temperatures and low As flux. This Selleck FK506 process drills nanoholes into the substrate which are surrounded by walls crystallized from arsenides of the droplet material [13]. A schematic of the droplet etching process is shown in Figure 1a, and typical atomic force microscopy (AFM) images of surfaces with droplet etched nanoholes are contained in Figures 2a,b. Figure 1 Schematic of the droplet etching process and AFM images. (a) Schematic of the combined

droplet and thermal etching process with deposition of Ga as droplet material during 2.5-s deposition time, droplet etching up to removal of the droplet material, and subsequent thermal etching during long-time annealing. (b) 1.7 ×1.7 µm2 top-view AFM micrographs illustrating the different stages for T = 650℃. The as-grown droplets with average height of 120 nm are visible at zero annealing time t a= 0 s. At t a= 120

s, all droplet material has been removed and nanoholes with average depth of 68 nm have been formed. After t a = 1,800 s, the hole width has been substantially increased by thermal etching. (c) Color-coded buy BYL719 perspective AFM images of the micrographs from (b). Figure 2 GaAs surfaces after Ga-LDE at temperatures above the GaAs congruent evaporation temperature. The Ga droplet material coverage is 2.0 ML and the annealing time t a= 120 s. (a) AFM images of LDE nanoholes for etching at T = 630℃. (b) AFM images of LDE nanoholes for etching at T = 650℃. (c) Linescans of a nanohole from (b). (d) Average hole density N, diameter and depth as function of the process temperature. The hole diameter is taken at the plane of the flat surface, and the hole depth is defined as the distance between the flat surface plane and PDK4 the deepest point of the hole. Nanoholes drilled by LDE can be filled with a material different from that of the substrate and so have several important advantages for the self-assembly of quantum

structures. For example, this allows the creation of strain-free GaAs quantum dots [14–16] with the capability to precisely adjust the dot size by filling the holes only partially. Furthermore, the realization of ultra-short nanopillars [17] has been demonstrated. In particular, the nanopillars represent a novel type of nanostructure for studies of one-dimensional thermal [18] or electrical [19] transport. The process of droplet etching is performed in two steps. First, Ga is deposited and self-assembled Ga droplets are formed in the Volmer-Weber growth mode [20]. In a second post-growth thermal annealing step, the initial droplets are transformed into nanoholes. Diffusion of As from the GaAs substrate into Ga droplets, driven by a concentration gradient, is the central process for droplet etching [13]. This is accompanied by removal of the droplet material, probably by detachment of Ga atoms from the droplets and spreading over the substrate surface [19].